3D AI Powered AOI Inspection

Screen Showing results of AOI Scan

KOHYOUNG Zenith UHS

Ultra-High-Speed In-line 3D AOI Inspection

The Koh Young Zenith UHS is an inline True 3D Automated Optical Inspection (AOI) system designed for high-volume SMT production environments where maximum throughput and inspection accuracy are critical. Utilizing Koh Young’s patented multi-projection Moiré technology, the Zenith UHS performs full 3D measurements of components, solder joints, and PCB features rather than relying on traditional 2D image comparisons. This approach significantly reduces false calls while improving defect detection and process control.

+ Incomparable True 3D Inspection Performance

+ IPC-based Solder Joint Inspection

+ AI-Powered Auto Programming (KAP)

+ KSMART Solutions: True 3D
Measurement-based Process Control System

+ Zero-defect through AI-Powered
Koh Young Process Optimizer (KPO) Mounter

Screen Showing results of AOI Scan

Maker-Ray AIS30X-HW

Inline THT Solder AOI

The Maker-Ray AIS30X-HW is an AI-driven Automated Optical Inspection system specifically designed for through-hole solder joint inspection after wave soldering or selective soldering processes. Unlike the AIS20X-HW, which focuses on component presence and placement verification, the AIS30X-HW concentrates on evaluating solder quality, making it ideal for manufacturers seeking to automate inspection of THT solder joints and reduce manual visual inspection.

Key Features

AI-Powered Solder Joint Recognition

  • Automatically identifies and classifies solder joints across the entire PCB.
  • Trained on extensive datasets covering more than 97% of common solder joint types.
  • Minimal programming requirements with automatic parameter optimization.

Advanced Defect Detection

  • Insufficient solder
  • Excess solder
  • Opens and non-wets
  • Poor solder fill
  • Solder bridges
  • Pin-related defects
  • THT and mixed-technology assembly solder issues

Multi-Color Illumination System

  • Multi-angle RGB lighting highlights solder joint shape and surface characteristics for improved defect detection.
  • High-brightness LED lighting with low-angle illumination.