Targeted Soldering of Select Components
In the manufacturing of complex or densely populated circuit boards, precision is of utmost importance. Selective Soldering stands out in this regard, as it allows for the application of flux to a specific area of the board. A robotically programmed nozzle is then used to apply solder with pinpoint accuracy, a level of precision unmatched by other methods.
This process is vital when working with thermally sensitive components. It reduces the failure rate and damage that could possibly occur using less exact processes like wave soldering or reflow ovens.
Flexible, Cost Effective, and Automated
Highly adaptable, our machines can be programmed to accommodate various board designs of any shape and configuration without retooling.
While programming the machine may represent an upfront investment, the long-run cost savings are reduced defects of cold solder joints, solder bridges, and overall process efficiency.
By integrating selective soldering machines into our line, we improve the efficiency of the seamless workflow, increase throughput, and raise our level of consistency by reducing defects across the board.
The Right Tools for the Job
Selective Soldering
Cerno 103IL
Selective soldering of printed circuit boards as
large as 610 x 457 mm (24.0 x 18.0 in.)
Interchangeable solder pots and pumps compatible with
tin-lead, lead-free and HMP solder alloy
SWAK-OS 4.0 graphics-based programming and machine control software enables fast and straightforward program creation
In-line flux and preheat module with concurrent fluxing and preheating provides increased throughput